Tag: Liu Dongya
Firms steer top wafer foundry Nexchip’s HKD6.98bn listing
Leading wafer foundry Nexchip Semiconductor lists on the HKEX main board on 10 July, raising around HKD6.98 billion (USD890 million)
Firms act on CPIC’s record-breaking HKD16bn convertible bonds
Baker McKenzie, FenXun Partners, King & Wood Mallesons, Linklaters and Haiwen & Partners have assisted China Pacific Insurance (CPIC)
KWM advises BOC, BOCOM on RMB285bn A-share issuances
BOC and BOCOM raise RMB285bn via equity offerings, with KWM as special legal adviser to both state-owned banks
KWM, Fangda assist Anxin Trust’s RMB9bn private placement
King & Wood Mallesons (KWM) and Fangda Partners assisted in Axin Trust’s restructuring in a USD1.26 billion private placement involving the issue of 4.375 billion shares
Nexchip taps KWM and Haiwen on RMB9.96bn Star Market IPO
King & Wood Mallesons (KWM) and Haiwen & Partners acted on Nexchip Semiconductor Corporation’s USD1.44 billion IPO on the Star Market, the largest A-sh are listing to date this year
